首頁
P

產品中心

Product Center

UPLD-150/200/300

UPLD系列設備,專為硅基功率器件背面退火量產工藝開發,采用優秀的模塊化設計及升級版方案,可實現超薄晶圓和大翹曲晶圓的精確定位及快速可靠傳輸,采用獨特的工藝參數匹配技術,兼顧實現淺層、深層的高效激活,滿足多工藝用途、大范圍應用的材料退火實際需求。
  • 產品介紹
  • 產品特性
  • 技術參數
  • 圖片參考
    UPLD系列設備,專為硅基功率器件背面退火量產工藝開發,采用優秀的模塊化設計及升級版方案,可實現超薄晶圓和大翹曲晶圓的精確定位及快速可靠傳輸,采用獨特的工藝參數匹配技術,兼顧實現淺層、深層的高效激活,滿足多工藝用途、大范圍應用的材料退火實際需求。
    UPLD System, is an advanced industrial solution for Backside annealing process of silicon power devices. The modular system is an attractive enabler for both process development and final industrial product. The integrated wafer handling technology provides precise, reliable and efficient wafer transportation for ultra-thin wafers and warped wafers. The excellent activation for both shallower and deeper applications can be achieved by our know-how technology, and the annealing performance and the throughput are well balanced.